Material analysis in detail
Let’s start with the heat sink. This is made of pure electrolytic copper and is quite thinly nickel-plated. You can still see the tool marks quite clearly and they are even less than 2 µm. But that doesn’t really matter, because there is also…
… the thermal paste. Here, however, PNY has reached into the rather cheap box, because it is a very simple and quite liquid silicone paste with corundum and zinc oxide. I don’t know how long it lasts, but I had to replace it after disassembly anyway. I would have preferred a more viscous paste or pad.
The memory modules sit on a light metal frame made of nickel-plated aluminum, which is thermally connected to the heatsink and the heatpipes and which also cools the voltage converters.
Now we come to the pads on the memory and the VRM. They are quite soft, somewhat oily and rely on Al2O3, i.e. aluminum oxide and, of course, silicone as a binder.
The non-nickel-plated heatpipes are made of the usual copper composite:
The anodized backplate of the removable rear cover is made of simple, anodized aluminium:
There is no GPU spring cross. That concludes the analysis part and we finally get to the benchmarks.
- 1 - Introduction, technical data and technology
- 2 - Test system and measuring equipment
- 3 - Teardown: Disassembling and cooler
- 4 - Teardown: PCB and components
- 5 - Teardown: Material analysis
- 6 - Gaming Performance FHD (1920 x 1080)
- 7 - Gaming-Performance WQHD (2560 x 1440)
- 8 - Gaming Performance Ultra-HD (3840 x 2160)
- 9 - Gaming Performance DLSS & FSR
- 10 - Power consumption and load balancing
- 11 - Transients, capping and PSU recommendation
- 12 - Temperatures, clock rate and tehrmal imaging
- 13 - Fan curves, noise and audio samples
- 14 - Summary and conclusion
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