The backplate as a cooling aid
The installed GDDR6X is a hot mess, in the truest sense of the word. And so that the small X-modules don’t burn up, you can help the system with the cooling and also cool it passively on the back. With this, I would now also have elegantly got the arc back to the backplate. Apart from the necessary stabilization of the thermally stressed board (bending!), the metallic surface can also be used as a heat sink.
The backplate got a recess because I also wanted to test a massive retaining bracket for the GPU casing, which turned out to be unnecessary, though. It also works without. In my case, I need ultra-soft 3mm pads and you can take anything that is reasonably good. Because of the recess, however, I had to do some trickery with the RAM components. So I first put the pad mat under the plate and traced the cutout with a felt tip pen.
Then cut out the areas where the RAM is located on the front. This can be solved even more generously than I do here, but in principle it is enough.
There is also a reason that I did not add pads to the VRM areas. In reality, the VRMs can withstand significantly higher temperatures and even have no significantly higher power dissipation in total. The RAM is therefore more important because the heat dissipation from the backplate to the surrounding air is also limited. The restriction to the essentials is better here than the mass paving with (the unfortunately much too expensive) pads!
The GDDR6X modules will still haunt us on the next pages, because from a cooling point of view, this is the biggest challenge!
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