Teardown and PCB analysis
After a few minutes of heating the cooler halves with a hair dryer, the adhesive thermal pads are weakened enough to carefully peel them off the board. G.Skill seems to use a different product for the thermal pad in the meantime. This is because unlike the previously tested 6400c32 modules, the pad here contains a fiber layer and a stronger adhesive (at least subjectively felt). A different heat conduction pad with better conductivity could also explain the significantly better temperatures in the heatsink test. However, the PMIC is still not thermally connected directly to the cooler, so its waste heat must be dissipated indirectly via the PCB and ICs. However, G.Skill still does not think this is necessary, and our test results prove them right.
The cooling elements themselves are also slightly different from the internal contour of the other Trident Z5 RGB kit. Here, the components above the memory ICs, the PMIC and the RGB lighting were given more space to avoid contact with the cooler and a possible short circuit.
The cooler halves measure just under 2 mm at the thickest point and the heat conduction pad to the ICs adds another approx. 0.5 mm on top.
The board itself seems to be largely unchanged, of course with the exception of the memory chips. As already mentioned, SK Hynix 16 Gbit A-Die ICs are used here, recognizable by the part number H5CG48AGBD X018. The suffix 233A is likely to stand for production week 33 in 2022. The Richtek PMIC with engraving 0D=90 K6W and the RGB controller with inscription 6K5850UA0, to which I could not identify a manufacturer so far, are also old acquaintances and identical to the other, previously tested SKU from G.Skill.
There is an imprint on the back that identifies the board. This is the 5GS1001D design, produced by Hsien Jinn in KW 01 of 2022. In addition, we find the usual references for safety certifications – the “RU” logo as well as the 94V-0 marking from Underwriters Laboratories (UL) for the North American market. The PCB is also the same as in the previously tested 6400c32 Hynix M-Die Kit from G.Skill and we could already confirm it as a 10-layer design back then. This also has identical dimensions to the JEDEC reference design, making it well suited for conversions to another cooler, such as a water block.
There are always markings on the board and ICs that look like they were made by hand with a highlighter. These could be binning and or quality markings, but I am not sure.
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