The PCB
AFOX has at least provided a 6-pin connector for power this time and no longer pulls everything through the PCIe slot, thank goodness. A total of four discrete phases for the GPU and one for the memory are in principle sufficient, but are not cooled. The rest is self-explanatory or even non-existent.
The cooling system
This section is now more interesting, because how do you cool a flat panel best? You can already see it in the slot bracket, which is completely built in with connections, and in the positioning of the cooler: Here, the DHE principle, i.e. direct heat dissipation out of the case, is unfortunately technically not possible.
Thus, we had to make a virtue out of necessity and move the cooler to the front. The air now blows out of the back of the card:
While the voltage converters are covered by the heat sink, the capacitors at the back now get a part of the exhaust air. A measurement with an IR thermometer showed an external temperature of just under 52°C for the capacitor cups after 30 minutes of continuous load of the card. This value is acceptable, especially since you’ll hardly reach this amount of waste heat development in normal use.
The heat is distributed via 4 massive copper heat pipes embedded in the aluminum heat sink. This solution has already proven itself in the Radeon HD 6850, whose TDP was nominally 20 watts higher.
Next, we’ll take a look at the benchmarks and see where the card ranks among the competitors.
- 1 - Einführung und Übersicht
- 2 - Teardown: Das Kühlsusystem und die Platine
- 3 - Testsystem und synthetische Benchmarks
- 4 - Benchmarks: Spiele DirectX 9
- 5 - Benchmarks: Spiele DirectX 11
- 6 - Temperatur, Leistungsaufnahme, Lautstärke
- 7 - Video-Check: Lautstärke im Vergleich
- 8 - Zusammenfassung und Fazit
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