Let’s start with the thermal paste on the GPU, which is actually a pad. In this version as a phase change material, it is long-term stable and better than most commercially available thermal pastes. The holes are created outside the die surface and are harmless.
After the phase change, a hardened mass of predominantly finely ground corundum (Al2O3) and even finer zinc oxide (ZnO) remains as a gap filler.
The nickel-plated copper heatsink of the GPU poses no puzzles; it is clean electrolytic copper. The tool marks of the milling machine are clearly visible even at 300x magnification, despite the nickel.
The pads between the heatsink and VRAM as well as the one on the voltage converters are ok and consist of slightly more viscous silicone, as well as corundum and zinc oxide as a thermal filler.
The inner mounting frame also serves as a heatsink for the voltage converters and is made of nickel-plated aluminum, as is the heatsink for the memory modules.
The heatpipes are also nothing new; we see an electroplated nickel layer on the heatpipes made of pure electrolysis copper.
The tin and bismuth solder used is a special type of solder material that is used in various technical applications, especially where lower melting temperatures are required or desirable.
The cooling fins are, we’re sure you’ll guess very quickly, made of simple aluminum that has been nickel-plated very thinly.
Speaking of thin, the fins are a good 0.2 mm thick and are therefore also suitable for elegant egg slicers.
The backplate is made of lightly anodized aluminium and not an alloy.
The GPU tension cross is interesting because the spring steel has been galvanized for a very long time. The colors and structures are almost like modern art.
Here we continue with the “deep drilling”, which took almost forever until I came across pure iron.
There is nothing more to report here. Of course, I did all the measurements and all the benchmarks of all the games before disassembling, because anything else would be pointless. And so we have an elegant transition to the next topic.
- 1 - Introduction, technical data and technology
- 2 - Test setup and methods
- 3 - Teardown: PCB and components
- 4 - Teardown: cooler and backplate
- 5 - Teardown: material analysis
- 6 - Gaming performance Full-HD (1920 x 1080)
- 7 - Gaming performance WQHD (2560 x 1440)
- 8 - Gaming performance Ultra-HD (3840 x 2160)
- 9 - Gaming performance DLSS / FSR (3840 x 2160)
- 10 - Power consumption, transients and PSU recommendation
- 11 - Tmepratures, clock rates and infrared
- 12 - fan speed, noise and audio-sample
- 13 - Summary and conclusion
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