Summary and conclusion
As already noted at the outset, the tested Frame products are all about the finer details. Above all, the simplicity of mounting and a consistent contact pressure for high, stable RAM clock rates are points where the wheat is separated from the chaff. When it comes to just the actual CPU temperatures, almost anything is an improvement over the Intel ILM, even no frame at all.
Regarding the number of required retraining cycles, I would like to note that this is of course strongly mainboard-dependent. In addition, a lower number of training cycles is not automatically better, because the board starts again from 0 with each boat. The fact that the training is reliably reproducible at some point is probably due to tensions or canting that occur during dre assembly and that are released by the waste heat after some time in the RAM stress test. The spreading thermal paste, which is jointly responsible for the contact pressure in the socket with the cooler, might also play a role here.
If we look at all the results together again, the Feng Zao Frame made of fiberglass is the winner of today’s test in terms of performance. The disadvantage of the frame, however, is that it is relatively difficult to obtain in Europe. Second place is taken by Thermalright and Thermal Grizzly together, with the former being significantly cheaper and easier to get hold of – ironic as that may be when compared to a German product in Germany. On top of that, the significant price difference and error-proof assembly also make the Thermalright Frame a clear recommendation.the only real no-go is the Jeyi frame, which simply could not fulfill its purpose.
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