A hot potato and the crux of heat flux density
I can already spoil that tomorrow there will be another special on the subject of cooling, where I also examined the IHS and the hotspots. However, this topic alone is much more extensive than simply putting it into a launch article that is almost bursting with information anyway. Then rather a separate article status, so that these important things are not lost in the general background noise. So we’ll come back to my test system, which uses my lab water cooling system that can provide a near-constant 20°C water temperature with up to two Alphacool Ice Age 2000 chillers and just over 20 liters of water in the reservoir.
I have all CPUs with a new Alphacool Core One Black Prototype, which I am not allowed to write too much about yet, but which has done its job properly so far. This also makes it clear that none of the CPUs have run into any thermal throttling and the new Ryzens have also always been able to keep their announced clock. And this is exactly where the problem lies, because even a good 360 AiO compact water cooler is pushed to its limits under continuous loads like Blender. Even running a Ryzen 7 7700X with an air cooler under such conditions becomes very sporty.
The Ryzen 7 7700X needs almost 100 watts less than the Ryzen 9 7950X under full load and still reaches very similar temperatures. Of course, this is also due to the smaller IHS area, its higher thickness and the increased heat flux density due to the new node on the dies, because more and more power dissipation is concentrated on less and less area. I have also made a very special video on this topic, which will also be included in tomorrow’s article.
The creation of the recordings on the uncooled CPU was a bit tricky, but I’ll tell you about that in detail tomorrow. Here is already a screenshot from the video, which shows the complete heating process of the CPU with a clever superposition and a special surface coating of the Ryzen 7 7700X. That’s all I want to spoil for now. Look and be amazed:
As far as the temperatures as such are concerned, you can of course still get by quite well with a “normal” AiO when gaming. Between 90 and 97 °C package temperature, you lose a total of about 100 to 200 MHz clock during rendering, but that is just within limits. When gaming, you should always be able to stay below 90 °C, which results in little or no noticeable clock losses. A good water cooler with no more than 30 °C water temperature should not exceed the 90-Gard mark even under load, unless the water block is no good. In gaming, you are then in the deep green area with 70 to 75 °C (or below). I will also write something about the air cooler.
However, it is a fact that good cooling and a decent thermal paste are the basic prerequisites for getting the Ryzen with its very unusual IHS cooled well. By the way, the fact that the IHS is so thick is also due to the fact that AMD has unfortunately offered some cooler compatibility here, so that the contact pressure is right again for an actually flatter CPU. Otherwise, most of the mounting kits would have had to be replaced. However, everything fits as usual and the massive backplate is, in contrast to Intel’s very flexible Socket 1700, a guarantee against bending and bulging of the CPU. This is good for the end customer and bad for the providers of any additional tools such as frames.
The original Lotes socket, which I already presented some time ago, relies on a massive plate, which I also consider to be absolutely usable and purposeful in reality and use with many CPU changes. I have unfortunately seen thinner steel sheet stabilized with beading again on some boards from other manufacturers, but I reject this type of cost down as there are better options as well. I can only advise buyers to take a look at the backplate of the base beforehand. At least for the X670E and X670 boards, such an economy measure is actually unacceptable.
If you want to read more about the base, I refer you to my older, exclusive article from January, where everything was already in it:
- 1 - Introduction, important preface and technical data
- 2 - Chipset, motherboard, memory and test setup
- 3 - Gaming Performance HD Ready (1280 x 720 Pixels)
- 4 - Gaming Performance Full HD (1920 x 1080 Pixels)
- 5 - Gaming Performance WQHD (2560 x 1440 Pixels)
- 6 - Autodesk AutoCAD 2021
- 7 - Autodesk Inventor 2021 Pro
- 8 - Rendering, Simulation, Financial, Programming
- 9 - Science and mathematics
- 10 - Power consumption and efficiency
- 11 - Temperatures and cooling
- 12 - Summary and conclusion
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