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AMD’s Socket AM5 v2 in detail – What is better in Ryzen than in Intel’s Socket LGA-1700 for Alder Lake | Exclusive

Today I turn for the first time in detail to AMD’s upcoming Socket AM5 (version 2), as it will be used for the upcoming Raphael CPUs (Ryzen 7000). AMD consequently changes from the PGA (Pin Grid Array) with the contacts on the CPU to the much easier to handle LGA (Land Grid Array) because of the large number of required (1718) pins. After we had already published three articles around Intel’s socket LGA-1700 and there were various problems with the bending of socket and CPU and as a consequence also real cooling problems, I will show you today that AMD does many things right (and also better) from the beginning. As a reminder, Intel’s socket problems and our workarounds in advance:

 

The AM5 v2 socket

Since AMD (in comparison to Intel) has been very fair with me and our medium over the whole years, I will deliberately limit today’s article to rather superficial and obvious things that can already be found in public in a similar form or that can’t cause any damage. Let’s call it live and let live. The complete drawings of the base and the surrounding area, as well as the exact technical specifications, will remain what they currently are: confidential. Nevertheless, the details shown here today are enough to get a first (positive) impression of the upcoming new socket.

 

At first glance, the locking mechanism with the stiffener frame, the force frame and the lever latch looks very similar to what we also know from Intel’s LGA sockets. The CPU is pressed centrally with two lugs towards the LGA socket, while another lug is hooked into the stiffening frame so that you can then apply pressure to the two central lugs using the lever.

But what is the difference between the two very similar looking sockets? These are important details, which, for example, quite smartly prevent the sagging of the entire plinth structure. Socket AM5 will already use a very similar backplate to Socket AM4 for each motherboard out of the box, where the outer threaded sleeves will again accommodate the front mounting of the cooler. However, four additional threaded sleeves have been added, which are screwed to the socket (SAM) and thus offer a much better hold than Intel’s soft, back-sided plate on the LGA-1700.

The advantage of this solution is obvious, because the acting forces are distributed over a total of 8 different points and also over a significantly larger area. Well done, that’s the way to do it right! The annoying fumbling of the CPU out of the socket casing, where inexperienced fingers often cause irreversible damage to the pins, is significantly reduced by the two recesses for the fingers. These larger lateral recesses also serve somewhat for ventilation, even if one could see the practical use rather questionable. The hobbyist, on the other hand, will be happy because he also gets the chance for the first time to introduce his own, flat temperature sensor below the CPU (of course, only practical, non-conductive and heat-resistant models!) to measure the socket temperature directly on the PCB.

Cooler assembly

The two mounting points provided by the factory pre-installed mounting kit can securely fix cooling solutions up to 500 grams as before, so not much will change and you will certainly be able to continue using older coolers as well. For anything heavier, the four outer screws including the mounting kit have to be removed and you then have to screw the cooler directly to the backplate. And exactly at this point it becomes problematic with the backwards compatibility!

The new socket AM5 comes with a special backplate whose necessary cutouts differ significantly from those of the older solutions! In addition, the complete retaining system (SAM) is screwed to this backplate. However, these two points definitely rule out the possibility of simply continuing to use existing AM4 coolers with their own backplates. In this case, the manufacturer has to supply adapted backplates, or the pre-screwed part can be used directly.

 

It will also be interesting to see which motherboard manufacturer, if any, will also tighten up the RMA conditions when it comes to socket removal or removing the original backplate. After all, this no longer makes any real sense, even though it could render many an old cooler worthless. The hurdle here is at least a bit higher than with the Socket AM4, even though you no longer have to hold the backplate after unscrewing the 4 outer screws (or tape it down with power tape) so that it doesn’t immediately disappear into the depths of the case.

Lade neue Kommentare

s
steinfg

Neuling

1 Kommentare 0 Likes

edit: mein fehler, ich dachte die CPU muss 8 kontaktpunkte haben, nicht die halterung

Antwort Gefällt mir

arcDaniel

Urgestein

758 Kommentare 302 Likes

Danke für den Artikel, das gefällt mir schon mal sehr gut.

Zur Backplate, nutzen nicht eigentlich die meisten die Origianale Backplate? Galube dass EK eine Zeit eine eigene hatte, aber auch die mittlerweile einfach die AMD Backplate nutzen.

Antwort Gefällt mir

s
simoncaspar

Neuling

6 Kommentare 0 Likes

Naja die ganzen Towerkühlerhersteller nicht: alpenföhn, enermax, bequit teilweise auch nicht.
Aios sind fast immer.

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N
Novasun

Mitglied

16 Kommentare 11 Likes

@Igor Wallossek Ja Mai, irgendwo muss AMD ja auch den Herstellern wieder ein Geschäft ermöglichen. Die Kühler-Hersteller freut es sicherlich.
Die Boardhersteller verdienen sowieso an der neuen Plattform... Und wenn AMD so saubere technische Arbeit abliefert - ja das freut den Kunden...

Antwort Gefällt mir

Igor Wallossek

Format©

6,167 Kommentare 9,686 Likes

Mich auch. Ich muss ja mit dem Zeig immer rummurksen :D

Antwort Gefällt mir

c
cunhell

Mitglied

73 Kommentare 54 Likes

Noctua verwendet die AMD-Backplate. Habe erst vor kurzem einen auf AM4 verbaut. Vier Kunststoff-Abstandshalter, zwei Metallbügel und vier Schrauben für die Befestigung und dann den Kühler mit zwei Schrauben auf der Halterung fixieren. Einfach zu montieren und hält.
Hat auch den Vorteil, dass man sich keine Gedanken machen muss, ob die Backplate auch wirklich 100% zum Board passt und nicht mit irgend einem Bauteil auf der Rückseite des Boards kollidiert.

Cunhell

Antwort 2 Likes

H
Herr-Reinspaziert

Mitglied

32 Kommentare 13 Likes

Eigentlich hat mir PGA bis jetzt gut gefallen, weil man immer direkt wusste: wenn es nicht butterweich geht, dann ist irgendwas falsch. Nach den ersten Berichten zu LGA-1700 war ich schon skeptisch, ob der kommende AM5v2 nicht mit ähnlichen Problemen zu kämpfen hat. Scheinbar hat man sich bei AMD ein wenig mehr Gedanken über den Nutzer bzw. die usability gemacht. Das sind bis dato erst mal gute Aussichten.

Antwort Gefällt mir

e
eastcoast_pete

Veteran

240 Kommentare 62 Likes

Ist der Hauptunterschied zum Thema 'Bendgate" zwischen AM5 und Intel's 1700 also im wesentlichen der, das AMD eine richtige Backplate und die vier Gewindehülsen vorschreibt, während Intel die Entscheidung den Board Herstellern überlässt? Wenn ja, dann war/ist das ziemlich dämlich von Intel!

Antwort Gefällt mir

Igor Wallossek

Format©

6,167 Kommentare 9,686 Likes

Und der Druck ;)

Antwort 1 Like

Gregor Kacknoob

Mitglied

81 Kommentare 60 Likes

Ich weiß, ich weiß... hier gehts um den Sockel. Aber finde nur ich diesen Heatspreader faszinierend? ^^

Antwort 3 Likes

Danke für die Spende



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About the author

Igor Wallossek

Editor-in-chief and name-giver of igor'sLAB as the content successor of Tom's Hardware Germany, whose license was returned in June 2019 in order to better meet the qualitative demands of web content and challenges of new media such as YouTube with its own channel.

Computer nerd since 1983, audio freak since 1979 and pretty much open to anything with a plug or battery for over 50 years.

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