Teardown: PCB layout and components
Let’s start with the PCB, which of course also corresponds 1:1 to the PCB of the non-super with Gainward and Gainward. NVVDD is still the most important voltage and this results in a voltage converter design with a total of 9 real phases and the resulting 9 control loops for NVVDD alone. Nothing has changed compared to the RTX 4070 Non-Ti, because in the end it is the same board. But it’s also about the price and so nothing else has changed. Fragmentation always costs extra and that doesn’t fit in well with the concept.
It doesn’t look as lean this time as it did with the RTX 4070 Super, but the card is also thirstier. Once again, separate PWM controllers are used for NVVDD (GPU core) and FBVDDQ (memory), as the top models among the PWM controllers are unfortunately far too expensive. Therefore, the good and well-known uP9512R from UPI Semi has to do the job again, but it is completely sufficient. A second PWM controller in the form of the small uP9529 is then used to control the two phases for the memory. Both controllers are located on the back of the board. Directly between them is a uPI uS5650Q for monitoring the 12V rails (1x Aux and 1x PEG). So there is no difference at all between the Super and Non-Super.
All DrMOS used, including those for the memory, are rather inexpensive products from OnSemi. The NPC302150 with 50A peak current used in all control circuits for NVVDD and FBVDDQ (memory) integrates a MOSFET driver, a high-side MOSFET and low-side MOSFET in a single package. This chip is specifically designed for high current applications such as DC-DC buck power conversion applications. This integrated solution reduces the footprint on the PCB compared to a solution with discrete components. The coils used for NVVDD and the memory have an inductance of 220 nH, the capacitors are in cup form, which is more favorable.
The 12V rails on the 12 4 12VHPWR connector are combined into a single rail directly after the socket, another is connected to the PEG and is only used to a limited extent for NVVDD. The BIOS is in the usual place and the generation of the remaining extra-low voltages is also as usual. So there are no more special features.
Teardown: The cooler
The backplate on the rear is not screwed from the top of the board, even with Gainward, and disassembly has therefore rarely been easier than it is now. A few screws (and seals) and it’s gone.
If you remove this backplate, the back of the board is exposed.
And anyone who reads my articles carefully will once again wonder why no pads were used to provide thermal relief for the voltage converters on the back of the board. Something like this would actually always be useful. All you had to do was cut out the foil on the inside and place pads on top. Mod incoming…
The rest of the story is quickly told. A solid copper heatsink is used instead of the usual vapor-chamber and a total of six nickel-plated heatpipes. But I’ll refer you to the next page, because this time there will also be a material analysis, which didn’t come as a big surprise. By the way, the pads used here are ok, i.e. ultra-soft and relatively thick, but also a little too thick for my taste. So please read on with interest!
The three fans have a rotor diameter of 9.5 cm and use 9 rotor blades with slightly more static pressure. That explains the principle well enough, as it’s still the same cooler.
- 1 - Introduction, technical data and technology
- 2 - Test system and measuring equipment
- 3 - Teardown: PCB, components and cooler
- 4 - Teardown: Material analysis
- 5 - Gaming Performance FHD (1920 x 1080)
- 6 - Gaming-Performance WQHD (2560 x 1440)
- 7 - Gaming Performance Ultra-HD (3840 x 2160)
- 8 - Details: Power consumption and load distribution
- 9 - Load peaks, cutting and power supply recommendation
- 10 - Temperatures, clock rates and infrared analysis including pad mod
- 11 - Fan curves and noise
- 12 - Summary and conclusion
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