Now we come to the socket, the spring contacts of the LGA (Land Grid Array) and the counterpart in the form of the copper pads on the bottom of the CPU. Even though the outer dimensions remain de facto the same, another 151 contacts are added on the inside.
This can be seen in the pad distribution, which I naturally don’t want to withhold from you. Intel defines two types of pads, depending on how they are constructed. A metal defined (MD) pad is a pad that is etched individually into the PCB and a trace with minimal width is etched out. The SMD (solder mask defined) pad is typically a pad in a “flood plane” where the solder mask opening determines the size of the pad for soldering to the component. In thermal cycling, by the way, an MD pad has proven to be more robust than an SMD type of pad, according to Intel.
- MD: Metal Defined (traditional trace via to BGA pad I/O Driven, typical 5 mil trace because of impedance matching. no Connect is a metal pad with no trace connected.
- WTMD: Wide Trace Metal Defined (trace is equal to or less than the pad diameter)
- WTMD >> 1WTMD = 1 Wide Trace, 2WTMD = 2 wide Traces, Multiple Wide Traces, can look or behave as a Spoke design
- SMD: Solder Mask Defined (100%, flood copper and/or larger metal pad)
Cover on and good…
- 1 - Intro & Overview
- 2 - Pin-Out LGA 1851
- 3 - Pad-Design (CPU)
- 4 - Socket LGA1851- Page 1
- 5 - Socket LGA1851- Page 2
- 6 - Socket LGA1851- Page 3
- 7 - Socket LGA1851- Page 4
- 8 - Independent Loading Mechanism (ILM) - Page 1
- 9 - Independent Loading Mechanism (ILM) - Page 2
- 10 - Independent Loading Mechanism (ILM) - Page 3
- 11 - ATX Board Keep Ins - Board Primary Side
- 12 - ATX Board Keep Ins - Board Secondary Side
- 13 - LGA1700/1851 Thermal solution KIZ
- 14 - Boxed Cooler and Conclusion
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