Teardown and disassembling
I’ll come to the cooler and the thermal pads later, but for now it’s all about disassembly. This is quite simple, by the way, with four screws to be removed.
Components and assembly
A certain highlight is the Phison E26 PCIe 5.0 SSD controller. It is an eight-channel controller with a bus speed of up to 2400 MT/s for the NAND packets, suggesting that it could reach up to 15,000 MBps. The E26 comes from an enterprise design, making it ideal for sustained workloads, and offers many powerful but optional features. The E26 sits on a 16 x 16 mm 576-ball FCCSP. It has two ARM Cortex R5 cores and 3 proprietary IP CoX processors.
It is interesting to note that MSI (like Corsair) also fitted the slightly higher controller on the M570 compared to the DRAM and the NAND with a solid underfill for reasons of stability and to avoid solder bead breakage because they were able to do so, and did the same with the DRAM. Interestingly, this feature has been omitted on the M580 this time, otherwise the boards are identical except for the NAND, which is twice as large, and another memory module
Contrary to certain descriptions to the contrary, the heatsink is made of pure electrolytic copper, which is first nickel-plated very thinly and then lightly chrome-plated. This can also be seen in the laser-engraved lettering, which shows this beautifully:
The DRAM used is Hynix H9HCNNNCPUMLCR-NEE (LPDDR4) and therefore a power-saving solution. This controller can therefore have 4 GB of DRAM, which is twice as much as usual. The DRAM is designed for a maximum temperature of 90 °C. Normally, however, this is not a problem, as the DRAM on SSDs is not heavily stressed even with dense workloads, but it is located directly next to the hot controller, which could even get hotter than 100 °C. LPDDR4 is a good choice in any case, as it is more efficient.
The Micron FBGA code on this flash is NY256 (MT29F8T08EULCHD5-QB:C), which indicates 4Tb, 232-layer TLC (B58R) NAND packages. Each of these packages contains four 2Tb dies (QDP) for a total of 4TB with four modules. This flash can operate at up to 2400 MT/s and the E26 can fully cover this range. However, there are performance limits that have led to the creation of different performance levels for the drives. The overprovisioning is 370.7 GB, i.e. slightly less than 10.0%.
On the next page, we now take a look at what I had just unscrewed: the cooler. And there will be something to say about the temperatures under load. Of course, I didn’t hear anything, because the part is passively cooled, thank goodness.
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