Intel already practicing IHS manufacturing for Alder Lake – late and early Rocket Lake CPUs compared

A few weeks before the launch of the upcoming Alder Lake CPU generation, Intel seems to be already experimenting with new Integrated Heat Spreader (IHS) manufacturing processes on Rocket Lake CPUs. Noticeable differences between a recently acquired model and a launch sample already give the first visual signs of a new manufacturing process. The sharp edges without chamfering and the lighter surface of the nickel-plated copper are striking to the eye. In addition, fewer adhesive residues around the IHS indicate a more precise assembly.

After the recent motherboard review of Gigabyte’s Z590 Aorus Tachyon, as mentioned at the time, my i9 test CPU died for unknown reasons. Since it was a tray CPU that I purchased myself, the RMA had to go through the online retailer. When I took the new CPU out of its box after about 2 weeks, I immediately noticed the visual differences to previous Rocket Lake CPUs. Besides a slightly different color of the PCB, especially the heatspreader with lighter surface and without rounded edges (left) is clearly different to previous RKL chips (right).

Initially suspected connections with the prefixes “V'” or “X” of the batch number or tray or boxed SKUs could be ruled out relatively quickly, because both types are also available with the old rounded IHS design. Only the manufacturing date with a few weeks before the launch of the next Intel generation seems to be a possible explanation for the apparently different manufacturing process of the IHS.

Late Rocket Lake

Early Rocket Lake

In keeping with gaming performance, Rocket Lake’s early IHS design was also a functional step backwards from Intel’s previous Comet Lake CPU generation. Because past the rounded edges TIM likes to press itself, both during cooler installation, and when cleaning after the dismantling. To that extent, this new, late design is as much a step forward functionally as it is visually, and a return to valued means. By the way, the dimensions of the heatspreader and also the capacitors around it are identical. For something to change here, we will have to wait a few more weeks for the new Alder Lake generation.

We see in this image above, by the way, once again for comparison the IHS of the new upcoming Alder Lake CPUs as an AI-edited representation of a pattern, here for a neutral symbol image.