After my last article about testing various thermal paste substitutes, I received some interesting feedback and even submissions from my readers, which I will gladly work through in chronological order. Besides great industrial pastes I first received a letter with copper paste and the request to test it. Why not? Copper is not the worst material when it comes to thermal conductivity.
Reading tip: Heat conductive paste against food, cosmetics and various lubricants. With expected unexpected outcome
In contrast to many tests already made with various more or less sensible or senseless substitutes, I tested everything with chiller and constant water temperatures as well as a good water block on a CPU with fixed 130 Watt power dissipation. The Ryzen 9 3900XT can thus still be cooled well. When choosing the power dissipation, I went to great lengths in advance to ensure that I could test even the worst subject for over 60 minutes. But here it ended at about 89 degrees with 130 watts on the CPU.
The measurement runs in each case after a warm-up phase (10 minutes Prime95) and then cooling down with 60 minutes Prime95, AVX and Small FFTs. In the inlet there is a temperature sensor whose difference (delta) to the set 20 °C water is subtracted from the measured value (Tctl/Tdie) in order to also take into account the fluctuations (max. +/- 1 degree deviation in both directions due to the hysteresis of the compressor cooler).
All of the replacement pastes shown here are not intended for long-term productive use, and long-term consistency is simply not a given, even with the better representatives. It is a feasibility study, the imitation of which is entirely at your own risk. All products shown here and tested as paste were purchased by the author himself or come from the author’s long-term stock or private household. Pixelation is done for many reasons, but with full intent and an imposed sense of duty.
Benchmarks, test system and evaluation software
The benchmark system relies on an X570 motherboard in the form of the MSI MEG X570 Godlike with a Ryzen 9 3900XT (PBO 130 watts, 200 MHz offset). Add to that the matching DDR4 3600 VIPER from Patriot, as well as several fast NVMe SSDs. Everything is cooled with chiller and about 30 liters of distilled water at a set temperature of 20 °C, which is the same as the room temperature.
I have also summarized the individual components of the test system in a table:
| Test System and Equipment |
|
|---|---|
| Hardware: |
AMD Ryzen 9 3900XT MSI MEG X570 Godlike 2x 16 GB Patriot DDR4 3600 VIPER 1x 2 TB Aorus (NVMe System SSD, PCIe Gen. 4) 1x 2 TB Corsair MP400 (Data) 1x Seagate FastSSD Portable USB-C Be Quiet! Straight Power 11 1000 Watt Platinum |
| Cooling: |
Alphacool Ice Block XPX Pro Alphacool Ice Time 2000 Chiller, 20l Reservoir |
| Case: |
Banchetto 101 |
| Monitor: | BenQ PD3220U |
| Power Consumption: |
MCU-based shunt measuring (own build, Powenetics software) Up to 10 channels (max. 100 values per second Special riser card with shunts for the PCIe x16 slot (PEG) NVIDIA PCAT and FrameView 1.1 |
| Thermal Imager: |
1x Optris PI640 + 2x Xi400 Thermal Imagers Pix Connect Software Type K Class 1 thermal sensors (up to 4 channels) |
| OS: | Windows 10 Pro (all updates, current certified or press drivers) |
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