Tag - Wärmeleitpaste

Company develops next-generation thermal paste (Leak)

The development of a next-generation thermal paste could not only improve the efficiency of heat dissipation systems, but also herald a new era in cooling technology. The mysterious company behind this project has developed a revolutionary idea that could fundamentally change the way heat is dissipated. Perhaps, because there have already been [...]


The Ultimate Thermal Paste and Pad Compendium: Application, Ingredients, Manufacturing, Optimization, Aging, Profit Margins and Marketing

Today I would like to dispel a few myths and, above all, explain why thermal compound is not just about the fillers and why there is a lot of marketing and even more inconsistencies and untruths in this gold-digger business. The article is also intended to raise awareness and help to separate honest and diligent suppliers from third-party [...]


CPU temperatures within limits? – Thermal Grizzly, Thermalright, Jeyi and Feng Zao LGA1700 frames in comparison test

Intel’s Alder Lake CPUs with their LGA1700 and Independent Loading Mechanism (ILM) including the bending problem have been around for 9 months now. The successor CPUs aka Raptor Lake might not be long away, but it has already been confirmed that they will use the same socket and thus most likely ILM as well. Existing motherboards with a 600 [...]


German Engineered Bend Aids for Intels LGA1700 – Thermal Grizzly CPU Contact Frame and Alphacool Apex Backplate Thermal Testing | Review

The LGA1700 socket, which Intel introduced for the 12th generation of their Core CPUs last November, is known to have one or two problems with bending hardware. For context, I recommend our other two posts if you haven’t read them already. But in short, the problem is that the clamping force of the ILM (Integrated Loading Mechanism) is [...]