MSI Radeon RX 5700 XT Evoke OC Edition tested – butter or margarine on bread? | English Review

1 - Introduction, Technical Data, Test Setup 2 - Tear Down: PCB and Cooler 3 - Benchmarks 1920 x 1080 Pixels 4 - Benchmarks 2560 x 1440 Pixels 5 - Benchmarks 3840 x 2160 Pixels 6 - Power Consumption in Detail 7 - Temperatures, Clock Rate, Infrared 8 - Cooling Fans, Noise Emission 9 - Conclusion and Bottom Line

Board layout and components

MSI uses a 7+2 phase design for the Evoke, whereby you can clearly see in the component selection that they buy together for motherboards and graphics cards. The used PWM controllers can be found on motherboards and also the used dual MOSFETs with the integrated drivers. They are looking like Smart Power Stages at first sight, but in real this are a bit cheaper integrated solutions (MOSFETS for high and low side plus drivers in one package) with which you can save space on the PCB.

MSI uses a short PCB with very few active components on the back. A second 8-pin connector would be possible, but is not used with this model. One of the VDDC phases for the GPU is fed from the motherboard slot (PEG), the rest via the external PCIe connectors.

The following table once again contains the most important components:

GPU
PWM Controller	IR35217 International Rectifier 8 Phases PWM Controller (7 used)
Gate Driver	integrated
VRM	7x NCP302155 ON Semiconductor Dual-MOSFET + Driver
Chokes	Encapsulated Ferrite Choke 150 mH
Memory
Memory	MT61K256M32 Micron 8x 8GB GDDR6 SGRAM-Modules 2 Channels x 256 Meg x 16 I/O, 2 Channels x 512 Meg x 8 I/O 14Gb/s
PWM Controller	NCP81022 ON Semiconductor 2-Phase Digital Regulator
VRM	2x NCP302155 ON Semiconductor Dual-MOSFET + Driver
Spulen	Encapsulated Ferrite Choke 330 mH
Sonstige Komponenten
BIOS	25WP080 EEPROM BIOS
Connectors	Input Filter, 560 mH
MCU	n/a
More Details
Features	7 + 2 Phase design 8-Pin + 6-Pin PCI-Express Power Supply

Cooler

The upper cover carries the two fan modules, each with 14 rotor blades and 8.7 cm diameter (opening 9 cm). The one-piece lamella cooler with the horizontal cooling fins underneath receives the waste heat from the nickel-plated heatsink via a total of four 6 mm heat pipes. One of the nickel-plated heatpipes made of copper composite material is bent over to both sides of the heatsink.

The memory module cools the MSI again via a cooling frame attached to the heatsink directly above the cooler. For the thermal transition, MSI uses thicker thermal pads, which could have been a bit larger, even if the GDDR6 in the package doesn’t take up the whole area. The pressure could have been distributed a bit better, even if it’s anything but critical.

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The backplate does not absorb any waste heat and is not integrated in the cooling system, but only of a purely optical nature.