Putty Comparison

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Comparison

General Information

Manufacturer
Halnziye
Honeywell
Designation
HY 268
HT10000

Manufacturer Specifications

Bulk Thermal Conductivity λ
8
10
Accessories
Nothing
Nothing
Container
Can
Can

Notes and Recommendations

Usability
Conclusion
Very sticky and average thermal conductivity. The application, removal and cleaning is a pain. Not recommended in any case.
High-Performance putty, not sticky and easy to apply and remove. Recommended in each case.

Measurements

Thermal Conductivity (W/m·K)
4.7
13.4
+186.6 %
Min BLT
10
185
Interface Resistance
22.8
21.5
Heat Conducting Particles and Matrix
Al2O3, ZnO, Silicone
Al2O3, Silicone
Particle Size
<15 µm
<= 10 µm

Minimum Possible Layer Thickness

This is exactly why I wanted to find out how far one can go with a bit of pressure and how much a putty can still be compressed below 250 µm. Here, I use the usual 9N pro cm², which is more than sufficient and exceeds the pressure typically achieved by, for example, a GPU cooler.

Thermal Resistances Rth

Let's start with the most important aspect, the thermal resistance Rth. The key property of Rth is its linear correlation with layer thickness, while thermal conductivity follows a completely different curve and remains far from linear. For memory, we are interested in layer thicknesses (BLT) of 1000 µm and below; for voltage regulators (VRM), they are usually between 1500 µm and 3000 µm, depending on the cooler design.

I have again illustrated the relevant layer thicknesses from 250 to 3000 µm as a bar chart for Rth for comparison.

Effective Thermal Conductivity and Cooling Simulation

If Rth is already available, one wouldn't actually need λeff, the effective thermal conductivity. We can also observe how the values change across the BLT, although one cannot expect a linear curve due to the included area and BLT.

I have again illustrated the relevant layer thicknesses from 250 to 3000 µm as a bar chart for λeff for comparison.

DRAM Simulation

VRM Simulation

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