Teardown: PCB layout and components
I have already discussed the changes in the load change behavior and power consumption in the previous articles, but more about that in this test later. First, let’s start with the board itself. NVVDD is still the most important voltage, resulting in a voltage converter design with a total of 6 true phases and the resulting 12 control loops for NVVDD alone, with another phase-shifted one generated from each phase via a doubler. Thus, one saves once again significantly compared to the RTX 4080, but this is acceptable in view of the significantly lower TDP.
The fact that phase doubling is now used instead of a solid single or parallel circuit makes perfect sense, because even the PWM controllers with 10 phases and more cost hard cash. And so MSI probably compromised in the end to at least keep the number of control loops for NVVDD at 12.
Thus, separate PWM controllers for NVVDD (GPU core) and FBVDDQ (memory) are used again, because the MP2891 from Monolith used on the GeForce RTX 4090 is currently one of the top models among PWM controllers and unfortunately also much too expensive. Therefore, the good and well-known uP9512R from UPI Semi, which can only generate 8 phases and is significantly cheaper, has to do it again. A second PWM controller in the form of the small uP9529 then controls the three phases for the memory. Both controllers are located on the back of the board, by the way. Directly in between is a uPI uS5650Q for monitoring the four 12V rails (3x Aux and 1x PEG).
All DrMOS used, including those for the memory, are rather inexpensive products from Alpha & Omega. The 55 A peak current AOZ5311NQI-03 BLN3 used in all control loops for NVVDD and FBVDDQ (memory) integrates a MOSFET driver, high-side MOSFET and low-side MOSFET in a single package. This chip is specifically designed for high current applications such as DC-DC buck power conversion applications. This integrated solution reduces the space required on the PCB compared to a solution with discrete components.
The coils used for NVVDD have an inductance of 120 mH, those for the memory one of 150 mH. MSI has made an effort to improve the quality, especially in the larger models, but it is still never completely without noise.
The 12V rails on the 12+4 12VHPWR connector are combined into one rail directly after the socket, another one is connected to the PEG but is not used for NVVDD. The dual BIOS is in the usual place and the generation of the remaining extra-low voltages is also as usual. So there are no more special features. The BIOS switch is labeled and set to Silent ex-factory.
Teardown: The cooler
The actual heatsink cools the GPU and RAM modules via a nickel-plated copper heatsink, and the rest is done via the thermally bonded, solid support structure that also cools the rear voltage converters. The front area relies on a cooling frame as an attachment (see below), which also stabilizes the slot panel.
With two 8 mm heat pipes and five 6 mm heat pipes made of nickel-plated copper composite, the waste heat from the vapor chamber is distributed via the lamella cooler.
The pads used are decent, malleable well, but still a bit brittle. Since they adhere very well, disassembling the card is not without its problems, as the pads are damaged for the most part and have to be completely replaced when reassembling. Very good, reasonably soft pads with a thickness of 1.5 to 1.75 mm should be used here. We already know the three 10 cm fans with 10 rotor blades each from the older SUPRIM-X models. It fits like this.
The backplate still passively cools a part of the GPU socket, but not more.
- 1 - Introduction, technical data and technology
- 2 - Test system and the igor'sLAB MIFCOM-PC
- 3 - Teardown: PCB and components, cooler
- 4 - Summary: gaming performance WQHD (2560 x 1440)
- 5 - Summary: gaming performance Ultra-HD (3840 x 2160)
- 6 - Detailled metrcis for WQHD (2560 x 1440)
- 7 - Detailled metrcis for Ultra-HD (3840 x 2160)
- 8 - Workstation and rendering
- 9 - Details: Power consumption and load sharing
- 10 - Load peaks, capping and PSU recommendation
- 11 - Temperatures, clock rates and infrared analysis
- 12 - Fan curves and noise with audio sample
- 13 - Summary and conclusion
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