MSI GeForce RTX 5090 SUPRIM SOC review – When the gram costs one euro and puts the FE in the shade

1 - Introduction, overview and technical data 2 - Test system and equipment 3 - Teardown: PCB, components and cooler 4 - Material analysis and heat conducting materials 5 - Gaming performance 6 - Power consumption, load peaks, PSU recommendation 7 - Temperatures, clock rates and thermography 8 - Fan curves and operating noise 9 - Summary and conclusion

As already announced, I will now also measure the thermal conductivity materials of the MSI RTX 5090 SUPRIM with my TIMA5 nanotester. This procedure is probably unique in its precision and depth of detail, as the TIMA5 enables a precise analysis of the thermal properties and thus allows a differentiated evaluation of the thermal pads used and the other thermal interface materials. These measurements go beyond conventional tests and provide detailed insights into the efficiency of heat transfer, which is of central importance for a card of this performance class. The results will not only evaluate the performance of the materials themselves, but will also show their influence on the overall cooling of the card and possible optimization potential.

Phase transition pad Honeywell PTM 7950

As I have only found remnants on the GPU, I am using my own measurement of an unused pad from my archive, as I will use it again during assembly. With over 6.3 W/mK, this durable pad is a better solution than almost all available pastes.

The thermal pads on the memory modules

The thermal pad used, with a thermal conductivity of 9.12 W/mK, stands out due to its exceptional performance and consistency. It differs from conventional pads due to its dry, almost rolled texture, which is reminiscent of a compacted thermal putty. This material offers some decisive advantages that not only influence the thermal efficiency, but also the mechanical load on the card. The dry and at the same time flexible consistency of the pad enables optimum adaptation to the uneven surfaces of the components and the cooler. This adaptability achieves a maximum contact surface, which significantly improves heat transfer. At the same time, the material structure reduces the pressure exerted on sensitive components such as VRAM modules or voltage converters. This significantly reduces the risk of mechanical damage or stress cracks.

The fact that the pad is good and suitable can also be seen from the almost linear curve, where the thermal resistance also behaves perfectly with increasing pressure and lower layer thickness. Another advantage of the material is its stability. In contrast to conventional, softer pads, which often tend to “bleed” or “oil out” – i.e. the release of liquid components under pressure or heat – this pad remains dimensionally stable and retains its thermal properties even under long-term stress. This not only increases the service life of the pad itself, but also the stability of the entire thermal solution. The material analysis shows that, similar to thermal conductive pastes, aluminum and zinc oxide as well as a silicone-based matrix are used.

The remaining thermal pads (VRM, coils, other active components)

The other thermal pads used, with a thermal conductivity of only 3.3 W/mK, belong to the lower middle class and only meet basic heat transfer requirements. The silicone-free matrix used in these thermal pads is based on special polymers that represent an alternative to conventional silicone-based materials. Such polymers offer several advantages, but also specific challenges when used as a heat conducting material.

Compared to silicone, silicone-free polymers are characterized by greater stability under thermal and mechanical stress. They are less likely to bleed or dry out under pressure or heat, resulting in a longer pad life and more consistent thermal performance. This is particularly important in applications such as graphics cards, where consistent heat transfer and material stability over an extended period of time are critical. Despite these advantages, silicone-free pads are often softer and less dimensionally stable, which reduces their mechanical resilience. They can deform under pressure and thus impair their thermal performance, especially if the pads are applied thinly or unevenly. This deformation is illustrated in the pads described here by the sharp drop in the performance data curve under pressure.

Silicone-free polymers are therefore an interesting solution for thermal pads, as they offer chemical stability and long-term reliability. However, their use requires careful adaptation to the specific requirements, especially when it comes to pressure distribution and mechanical resilience. Optimizations in the material composition could minimize these weaknesses and bring out the advantages even better.

Analysis of vapor chamber and aluminum carrier frame

The large vapor chamber of the MSI RTX 5090 SUPRIM is made of pure electrolysis copper and is a central element of the cooling concept and has a nickel coating. This design offers several technical advantages that improve both the efficiency of heat dissipation and the longevity of the components. The nickel coating of the vapor chamber offers additional advantages. Nickel is not only corrosion resistant, but also protects the sensitive copper surfaces of the chamber from oxidation.

This protective coating is particularly important in environments with high humidity or aggressive chemical conditions, as it ensures the long-term stability and performance of the chamber. In addition, nickel improves the mechanical stability of the surface, which increases the durability of the entire cooling structure. Another advantage of nickel coating is its compatibility with modern thermal pastes and pads. Some materials, especially those with metal particles, can react chemically with uncoated copper. The nickel coating prevents such reactions and ensures that the thermal properties remain constant over the entire service life.

Now we come to the skeleton of the radiator. Aluminum-magnesium alloys are an excellent choice for frames in high-performance applications such as graphics cards, as they offer a good balance of strength, weight and thermal stability. These properties make them particularly suitable for applications that require both mechanical stability and good thermal resilience. A major advantage of aluminum-magnesium alloys is their high strength combined with low weight. The low weight of the alloy reduces the overall mass of the frame, which is particularly important in compact electronic devices in order to minimize mechanical stress on circuit boards and plug connections. At the same time, the high strength ensures that the frame remains dimensionally stable even under high loads, such as those caused by heavy heat sinks or uneven pressure distribution.

In terms of thermal load, aluminum-magnesium alloys offer good thermal conductivity, which is lower than that of pure aluminum but sufficient for most applications. This thermal conductivity makes it possible to effectively dissipate heat from critical components such as voltage transformers. Due to the thermal stability of the alloy, the shape remains constant even during temperature changes, which is an advantage for components with a narrow tolerance range. Another advantage is the high corrosion resistance of aluminum-magnesium alloys, especially if they are additionally nickel-plated, as is the case here. This protects the support frame from oxidation and mechanical wear, even under demanding environmental conditions such as high humidity or dust exposure.

That concludes this part and we’ll play a round. Turn the page please!