More capacity, even less clock – Samsung 24 Gbit B-Die in the G.Skill Ripjaws S5 DDR5-5200 CL40 2x 24 GB kit tested with OC and teardown

1 - Intro and unboxing 2 - SPD information and heatsink test 3 - Teardown and PCB analysis 4 - XMP compatibility and overclocking 5 - Benchmarks - XMP 6 - Benchmarks – OC 7 - Summary and conclusion

DDR5 24 Gbit ICs or modules with 24 or 48 GB capacity have been available on the market for some time now, but so far only from SK Hynix and Micron. Samsung has now also followed suit and today we are taking a look at their first 24 Gbit product, the DDR5 Samsung 24 Gbit B-Die, in the guise of a G.Skill Ripjaws S5 kit.

Especially for workstation users, the ICs with the rather strange intermediate size of 24 Gbit are an interesting choice, also because the load on the memory controller of the CPU is effectively identical to that of 16 Gbit ICs. Theoretically, this means 50% more capacity at the same clock rate and the same timings. We have already tested Micron’s 24 Gbit Rev B ICs – I’ll link it again here. Hynix 24 Gbit M This is unfortunately still missing in our graphs, but is unfortunately irrelevant for comparison for today’s test anyway – I can already spoil that much.

Thanks to forum posts, we were able to locate Samsung’s new 24 Gbit ICs in a G.Skill Ripjaws S5 5200 CL40 kit, which at around 120 euros for 2x 24 GB DDR5 modules doesn’t seem unattractive, at least initially. However, such a conservative XMP-SKU at 1.1 V voltage lowers expectations somewhat. If the ICs had more potential, G.Skill would surely use this for more aggressive XMP profiles, wouldn’t they?

Unboxing

I have G.Skill Ripjaws S5 modules in my hands for the first time today. The Ripjaws series from G.Skill was already available at the time of DDR4 and was always the somewhat cheaper and simpler alternative to the TridentZ products; this is also the case with DDR5 with the Ripjaws S5.

The packaging has also remained spartan. A blister made of transparent plastic and clamp closure holds the modules in position. In the background there is a cardboard insert with the most important information about the product and a sticker and a quick guide are also flying around.

The modules are relatively simple. The black circuit board is encased by the cooler halves made of black painted aluminium. Unlike DDR4, these Ripjaws are flat at the top and only build up a minimal height above the PCB. A “Ripjaws S5” lettering with a red-white-grey underline adorns the top left of each half. At the bottom right, there is also a “G.SKILL” lettering surrounded by many small holes that give it an industrial flair.

The radiator half on the other side is manufactured completely identically – clever, because it is cheaper to produce – and only the sticker with the specifications is different here. On it we find the SKU number “F5-5200J4040A24GX2-RS5K”, as well as the XMP profile with DDR5-5200 CL40-40-40-83 1.10v for 24Gx2 modules in Intel XMP3.0. There is also an internal product number “0R48AXR810B”, which already shows the memory ICs used, similar to Corsair and the “Version”.

Of the last 3 characters, the numbers stand for the DRAM manufacturer and the letter for the die revision. so 10 is Samsung (20 Hynix, 30 Micron) and B for B-Die. I do not know what other information can be derived from the character string. Finally, the month of manufacture of the modules “2024 Jul” and the serial number are printed here.

As expected, these are single-sided modules with 8 DDR5 ICs each. The back is filled with a foam placeholder.

At the top there is another “G.SKILL” lettering in white and you can clearly see the cooler halves, which are interlocked on the left and right.

Incidentally, the modules are also available in white, recognizable by a “W” at the end of the product number instead of the “K”. The white lettering here is then black.