It certainly does not affect only the one manufacturer I have to name today on the basis of a concrete example, and even then not always in the same severity. However, if the pad already has a weak point in its composition from the factory, hot GDDR6X memory and still intensive use come together, then it will already be tight. Very tight, because you don’t even have to do mining there, because rendering or folding does it just as well. Looking at the first image now, we see very photogenic puddles on this MSI GeForce RTX 3080 SUPRIM 10 GB, almost as perfect as in NVIDIA’s most beautiful RTX demos. It shines and reflects around the bet. Except it’s not water, it’s pure silicone and in huge quantities.
What actually happens to the pads?
Most very soft pads contain lots of silicone as the base material, which is then mixed with special fillers that provide the specific thermal conductivity and shape-matching properties, as well as flame retardants. The consistency of course depends on many factors and it depends not only on the content of the pad but also on its manufacturing process, how high the degree of hardness and silicone content will be in the end. There are also silicone-free pads, those made from a polymer with a low modulus of elasticity, those with a glass fibre or rubber backing (see Laird’s or Ziitek’s “crumbs”), or pads as an unreinforced product, which are more like a very viscous paste and can be handled and shaped almost like plasticine.
Since the memory modules do not have an underfill, too much pressure is extremely damaging and in the worst case can also cause the solder pads to tear off. After all, we reluctantly remember Space Invaders and NVIDIA’s GeForce RTX 2080 Ti in that regard. Same reason and identical consequences. Feel free to read that again, too, because it still applies.
And that you have to use such soft pads is due to the high tolerance ranges of the boards, especially with the height of the package with the GPU. This is often higher (because bent) than it was intended and therefore the gaps between memory and heatsink are also very different from card to card. That’s why manufacturers are now using these ultra-soft pads in a much greater thickness than the ideal case would actually require. If the bending is stronger, there is still thermal contact, and in the opposite case, everything just pushes away. In the true sense of the word, because the resistance of the mass of the cheaper pads is not very stable and the base material (the silicone) is virtually squeezed out. What remains are the filler particles, which then harden and can also crack.
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