It’s over 7000! – Teamgroup DELTA RGB DDR5-6400 CL40 2 x 16GB kit Review with Overclocking and Teardown

Teardown

The disassembly of the heatsink is as simple as its construction. Only the adhesive should be heated beforehand so that the various components can be detached from each other as easily as possible.

The memory ICs are connected to the heat sink with a long, adhesive thermal pad, which is cut out accordingly for the design so that nothing protrudes. The RGB lighting element is also simply attached with double-sided adhesive tape between the two aluminum halves, stabilizing the module at the bottom and top. Only the PMIC in the center does not have another layer of adhesive itself and instead has an extremely soft, yellow thermal pad. The component imprints show that all components have good contact despite their different heights. So the concept of the cooler design works here as well.

The foam layer on the back makes disassembly a bit more fiddly, but if you have a bit more patience than me, you should be able to remove it in one piece. Only the 8 RGB LEDs and their controller are installed on the board. The LEDs simply shine upwards into the acrylic element, where the light is then evenly distributed.

The aluminum cooler halves are 0.82 mm thick, with another 1.00 mm of thermal padding for the memory chips.

The heat conduction pad for the PMIC area should be about 0.5 mm thicker again, but cannot really be measured accurately due to its extreme softness.

PCB analysis

The board is a rather plain design, close to the A0 reference from JEDEC. The dimensions of the board also correspond to the A0 reference design, which ensures compatibility with most aftermarket coolers. The grounding layer on the top is striking, which should provide better shielding and thus signal integrity.

On the edge of the module there are markings with “1” and on the other side “8”, revealing the number of PCB layers. since the market launch of DDR5, 8 layers are among the highest that can be bought, whereas cheaper or slower kits often still use 6 layers. Kits with 10 layers have only recently become freely available, although this does not necessarily mean an advantage for the OC potential, but more on that in a moment.

As you would expect with an XMP clock rate of 6400 Mbps, Hynix 16 Gbit M-Die ICs are used as memory chips. We had already shown the exact breakdown of the engraved part number in a previous review.

The PMIC is a component with the rather inconspicuous label 0D-9A 53J, although we can already identify it as being manufactured by Richtek from previous tests. The SPD EEPROM carries the hard to recognize inscription “511 8Y1 1HL”, whereby it is again like the VULCAN modules a make of Renesas – I want to spoil that much.

The RGB controller is the widely used ENE 6K5830UA0, which favors compatibility with various control software.

Finally, we find an embossing in the board to their manufacturer. The number KO-8826A-5 and the HJ logo indicate Hsien Jinn from Taiwan. Furthermore, the code 21 48 probably hides the week of manufacture of the board. Finally, the “RU” logo and 94V-0 marking indicate safety certifications from Underwriters Laboratories (UL) for the North American market (thanks, Mick).