After testing the components on the GPU, it is now the turn of the SMD rework station with selective soldering. Already during the heating phase of the hotplate, I heard an unpleasant crackling sound. Experience has shown that this indicates a mechanically warped PCB, which will settle again due to the temperature expansion coefficient of the PCB material (copper, carbon, aluminum and FR4). However, this alone is not enough, because the deformation of the board to its original state also means that torn solder balls can be expected under highly integrated chips.
For this case, however, we have special flux for BGA chips in our repertoire. Due to its special viscosity, this special flux is also able to creep under chips and thus to the solder joints. The increased capillary action of the liquid allows it to be applied to one side of the chip, and just a few seconds later it reappears on the opposite side. This has the same effect as the often used underfill with glue, which PowerColor omits. In the picture we now see the applied BGA flux (note the slightly darker liquid around the RAM):
This flux is also ideal for less integrated components such as filter capacitors directly behind the GPU chip:
Now that we have re-soldered the critical components with the BGA rework station and a hot air soldering station, it’s time to reapply the thermal pads, as well as the thermal paste (I have spread the paste, Igor, as a grill master, likes more the sausages):
Next, we connect the card naked to a lab power supply to see if there is a short or general power draw without PCIe detection. At this point, everything looks good and the values are within the expected range.
- 1 - Graphics card death, eBay and the circumstances
- 2 - Initial findings and head shaking
- 3 - Wound dressing and referral to specialist
- 4 - ELITKon who? Things that only the specialist can manage
- 5 - Disassemble, test and measure
- 6 - Flux, Reflow and the Miraculous Recovery
- 7 - Commissioning, summary and hospital address
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