Biwin Black Opal X570 PRO Review – A new player on the market with an interesting product and minor weaknesses

1 - Introduction and Technical Data 2 - Teardown with Component and Material Analysis 3 - Streaming and Root Cause Analysis of Drops 4 - Synthetic Benchmarks 5 - Workstation Benchmarks 6 - Temperatures, Power Consumption and Conclusion

Biwin is a Chinese manufacturer specializing in the development and production of storage solutions. The company offers a wide range of products, including solid-state drives (SSDs), DRAM modules and flash memory. Biwin is active both as an OEM partner for well-known brands and under its own product lines such as “Black Opal”. The latest product in Biwin’s portfolio is the “Black Opal X570 PRO” SSD with 4 TB of storage, which is being tested today. This M.2 SSD uses the PCIe 5.0 x4 interface and the NVMe 2.0 protocol. It is equipped with the SM2508 controller from Silicon Motion, which is manufactured in a 6 nm process and has eight channels. The SSD uses 232-layer TLC NAND flash from Micron and offers capacities of 1 TB, 2 TB and 4 TB. The Black Opal X570 PRO is compatible with Intel and AMD platforms and offers backwards compatibility with PCIe 4.0 and 3.0 . It is suitable for both desktop systems and notebooks and is designed for demanding applications such as gaming, video editing and data-intensive workflows.

In terms of performance, the X570 PRO achieves sequential read speeds of up to 14,000 MB/s and write speeds of up to 13,000 MB/s, according to the manufacturer. The random read and write speeds are up to 2,000,000 and 1,600,000 IOPS respectively. The SSD is equipped with a DRAM cache of up to 4 GB and has a pSLC cache of around 208 GB. But I will test that today. For thermal control, Biwin relies on a graphene heat conducting film which, in combination with the energy-efficient controller, ensures effective heat dissipation. The SSD is equipped with technologies such as ECC error correction, wear leveling, garbage collection and TRIM to ensure data integrity and longevity. A five-year warranty with a TBW rating of up to 3,000 TB underlines the reliability of the product.

Scope of delivery and unboxing

The unboxing of the Biwin X570 PRO 4TB SSD is functional and matter-of-fact, without superfluous decoration. The packaging consists of a sturdy, matt black cardboard box with a slight gloss finish and contrasting elements in purple, pink and blue, which visually emphasize the product name. The design incorporates modern technical elements, but has a restrained overall effect. The SSD is shown as an illustration on the front, while there is a window on the back through which the actual SSD with label and serial number can be seen. Key technical data such as maximum read and write speed, temperature ranges and form factor are also clearly printed.

After opening the flap, the plastic insert with the SSD can be removed. This fits perfectly in a thermoformed PET shell, which protects the drive from mechanical stress during transportation. It is striking that Biwin does not rely on simple inserts here, but has optimized the packaging for stable storage in stationary retail. The SSD itself is fully labeled and contains all marks of conformity (CE, FCC, UKCA etc.) as well as information on the validity of the warranty in the event of damaged or removed seals.

It is pleasing that Biwin has also included a small accessory set: In addition to the SSD, the plastic insert contains a precise screwdriver in ballpoint pen format with a ribbed grip zone and a matching M.2 screw. This enables the SSD to be installed immediately, even if no corresponding accessories are included with the mainboard. Given the high price level of the 4 TB version, this detail is more than just a nice gesture, as it prevents typical installation problems, especially with older or OEM systems.

There is no printed manual or software card included in the scope of delivery. A separate cooling solution is also missing, but this is logical as Biwin relies on a flat graphene thermal pad under the label, which does not create any additional height. The SSD can therefore also be used in particularly flat devices, such as SFF housings or notebooks that do not tolerate high heat sinks. Overall, the unboxing conveys a well thought-out, practical impression. The packaging is functional, provides reliable protection and, with screws and tools, supplies exactly the accessories required for a smooth installation. The only criticism would be the lack of documented information in paper form, although this can be considered bearable in view of the target group.