AMD’s SR1 and SR2a boxed coolers (or more accurately, Processor-In-a-Box, PIB) for Socket AM5 processors divert airflow in four orthogonal directions – along and perpendicular to the clip axis. Here AMD chooses a slightly different path than Intel, whose round PIB actually releases air into all sides in the same orientation. The large SR4 heatsink, on the other hand, only dissipates airflow in 2 directions, perpendicular to the clip axis. The following figure shows the airflow exhaust of the heat sink with orthogonal flow.
These Socket AM5 processor heatsinks provide airflow to the additional components on the motherboard, allowing the use of lower cost passive heatsinks for the surrounding components such as the discrete GPU and most importantly, the voltage converters. The principle is well known and proven and also the reason why you should not equip the especially low-priced boards with water coolers, nor with too strong CPUs. With a bit of bad luck, the necessary air flow is missing there and thermal problems occur.
The PIB SR1 for the CPUs with 45 and 65 Watts TDP
We can see a very flat construct in the picture, which does not rely on AMD’s well-known clamp solution, but is directly attached with the four screws. To do this, of course, the two retention frames must be removed. The pressure is guaranteed by springs, the screws use stoppers which result from the thread length. With a height of not even 5.5 cm, the cooler, probably manufactured at AVC, is also suitable for the smallest box.
The PIB SR2a for the CPUs with 95 Watts TDP
The design of the all-aluminium cooler is similar to the small SR1 version, but the height increases to 6.84 cm. Now this is not much more and might well be connected with noise. The experience with the predecessor models has shown that it always became even really quiet when such a PIB was mounted on a lower TDP class. Also, AVC should be the OEM.
The PIB SR4 for the CPUs with 105 Watts TDP
The large radiator is no longer an orthogonal radiator. It also relies on a heatsink with four ground and pressed-in heatpipes and their direct contact on the CPU (DHT, Direct Heat Touch). We also see the USB again as well as an aRGB port, so not that much should have changed at all, if anything. The height of 9.29 cm is quite large and the width of 10.8 cm as well as the depth of 10.5 cm are not really small, but not much bigger than the SR1 and SR2a. And again, the assumption lies with AVC as the manufacturer.
On the following pages I have now the details of the socket, the backplate and the relevant areas for cooler and components. After all, nothing should be damaged, but fit well. The differences are once again in the details!
- 1 - Der Sockel AM5, das Mounting und sechs TDP-Klassen
- 2 - Die orthogonalen Kühler SR1 und SR2a sowie der SR4
- 3 - Processor Keepout and Hight Restrictions
- 4 - Processor Mounting Holes, Contact Pads and No-Routing Zone
- 5 - Socket Outline View and Socket Window
- 6 - Heatsink Height Restriction Zone
- 7 - No Through Hole Components Zone
- 8 - Board Bottom-Side View
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